Drawing an Infinite Industry Blueprint with Direct Imaging Equipment

PCB, also known as Printed Circuit Board, is a carrier for the interconnection of electronic components and electrical appliances. It is almost present in every electronic device. With continuous breakthroughs in PCB laser marking technology, QR codes, barcodes, characters, and other information can be quickly and clearly marked on densely packed PCB boards of various sizes, aiding the development of electronic products towards miniaturization, precision, and intelligence in the field of precision marking.

The high-level development trend in the PCB and broader semiconductor fields catalyzes the renewal of existing lithography technology. Compared to traditional exposure and mask lithography, direct imaging and direct write lithography technologies have more leading advantages.

Advantages of PTC Laser Direct Imaging Equipment

Laser direct imaging equipment has a wide range of applications and plays an important role in screen printing plate making. PTC laser direct imaging equipment can directly expose on the surface of printing materials and incorporates UV laser technology, the DMD core component from American TI company, a high-power 405nm laser module, and a high-precision motion system.

PTC's laser direct imaging equipment not only saves time and costs associated with film production but also eliminates registration errors and image distortion in the traditional exposure process, ensuring the quality of printing materials and improving work efficiency.

Promising Prospects for Direct Imaging Equipment

In the field of  PCB manufacturing, lithography technology can mainly be divided into direct imaging technology and traditional exposure technology based on whether a photographic film is used during exposure. Compared to traditional exposure, direct imaging equipment has cost and technical advantages. Compared to traditional exposure technology, direct imaging equipment has overwhelming advantages in lithography precision, registration precision, yield rate, environmental friendliness, production cycle, production cost, flexible production, and automation levels.

As downstream electronic products develop towards portability, thinness, and high performance, the PCB industry gradually moves towards high density, high integration, fine lines, small apertures, large capacity, and thinness, driving continuous upgrades in PCB product structures. Under the trend of high-end PCB products, the requirements for exposure precision (minimum linewidth) of direct imaging equipment are gradually increasing.

The minimum linewidth that direct imaging equipment can achieve in PCB industrial production has already reached 5μm, making it the mainstream technical solution in the manufacture of mid-to-high-end PCB products. The high-level development trend of PCB catalyzes the renewal and replacement of existing PCB exposure equipment, with strong demand for direct imaging equipment to replace traditional exposure equipment.