In the semiconductor industry, quartz is widely used. And high-purity quartz products are important consumables in wafer production. The main application of quartz components in the semiconductor field is the diffusion and etching process in wafer foundry, which can be divided into high-temperature zone devices and low-temperature zone devices. The main devices that will be used are as follows:
① Devices in the high temperature zone are mainly furnace tubes, glass boats, etc. used in diffusion oxidation and other processes. They need to be direct or indirect contact with silicon wafers in a high temperature environment. After purchasing fused silica glass materials, these devices will be produced through thermal processing.
When controlling the internal residual stress of the fused silica tube in the figure below, it is recommended to use a manual quantitative glass polariscope (model NO PSV-413). You can intuitively and clearly see where the stress is concentrated and measure the optical retardation value caused by the existence of stress. In Figure 1, the stress is concentrated at the blue position. When we switch to the quantitative measurement method ( senarmont method ), the blue area in Figure 1 turns the white area in Figure 2. When we slowly turn the scale on the top analyzer, the color of the white area in Figure 2 will gradually darken until it turns into the dark brown area in Figure 3.
Figure 1
Figure 2
Figure 3
② The devices in the low-temperature zone are mainly quartz rings in the etching process, and flower baskets and cleaning tanks during the cleaning process. After purchasing gas-refined quartz glass, these devices are produced through cold processing. The quartz cleaning tank in the picture below is made by hand firing. When controlling its internal residual stress, it is recommended to use an enlarged handheld Polariscope (model NO PSV-202-DL).
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